Enhanced wafer cleaning method
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United States of America Patent
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Aug 4, 2009
Grant Date -
Jul 17, 2008
app pub date -
Dec 11, 2007
filing date -
Feb 17, 2005
priority date (Note) -
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Abstract
A method for removing post-processing residues in a single wafer cleaning system is provided. The method initiates with providing a first heated fluid to a proximity head disposed over a substrate. Then, a meniscus of the first fluid is generated between a surface of the substrate and an opposing surface of the proximity head. The substrate is linearly moved under the proximity head. A single wafer cleaning system is also provided.
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