Nozzle arrangement with a top wall portion having etchant holes therein
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United States of America Patent
Stats
-
Aug 4, 2009
Grant Date -
May 15, 2008
app pub date -
Jan 21, 2008
filing date -
Jul 15, 1997
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
The current invention provides for a nozzle arrangement for an inkjet printer. The nozzle arrangement includes a wafer substrate defining an ink supply channel therethrough, with side wall portions and a top wall portion arranged on the wafer substrate to define a nozzle chamber for operatively receiving ink, said top wall portion defining an ink ejection port and a plurality of etchant holes therein of sufficient diameter such that surface tension effects restrict ink being ejected from the chamber via the etchant holes. The nozzle arrangement also includes a thermal actuator cantilevered on the wafer substrate so that the actuator partitions the nozzle chamber, the actuator having a heater layer which produces thermal expansion of said actuator upon activation, thereby ejecting ink from the nozzle chamber via the ejection port.
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