Method for dicing wafer and process for manufacturing liquid-discharging head using the dicing method
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United States of America Patent
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Aug 4, 2009
Grant Date -
Nov 3, 2005
app pub date -
Apr 25, 2005
filing date -
Apr 28, 2004
priority date (Note) -
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Abstract
A method for dicing a wafer having a first face in which opening are arranged along dicing streets. The method includes a step of affixing a dicing tape to the first face such that the dicing tape lies over the openings and adhesive regions of the dicing tape are exposed in the openings and a step of treating the dicing tape to reduce the adhesive strength of the adhesive regions.
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