Methods for securing packaged semiconductor devices to carrier substrates
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United States of America Patent
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Aug 4, 2009
Grant Date -
Feb 9, 2006
app pub date -
Sep 1, 2005
filing date -
Dec 31, 1997
priority date (Note) -
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Abstract
A method for securing a semiconductor device to a carrier substrate includes inserting a semiconductor device with a plurality of stub contacts extending from a bottom edge thereof into a receptacle of an alignment device associated with the carrier substrate. Upon attachment of the alignment device to a carrier substrate and insertion of a vertically mountable semiconductor device into the receptacle, the semiconductor device is biased so as to establish and maintain electrical communication between the semiconductor device and the carrier substrate.
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