MEMS device and interconnects for same
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United States of America Patent
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Aug 4, 2009
Grant Date -
Feb 12, 2009
app pub date -
Aug 7, 2007
filing date -
Aug 7, 2007
priority date (Note) -
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Abstract
A microelectromechanical systems device having an electrical interconnect between circuitry outside the device and at least one of an electrode and a movable layer within the device. A layer of the electrical interconnect is formed directly under, over, or between a partially reflective layer and a transparent layer of the device. The layer of the electrical interconnect preferably comprises nickel.
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