Polishing apparatus and pad replacing method thereof
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United States of America Patent
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Aug 11, 2009
Grant Date -
May 29, 2008
app pub date -
Aug 20, 2007
filing date -
Nov 24, 2006
priority date (Note) -
In Force
status (Latency Note)
Importance
Abstract
A polishing apparatus and a pad replacing method thereof are provided. The polishing apparatus includes a first clamping element, a second clamping element and a polishing head. The first clamping element includes a first upper clamper and a first lower clamper for clamping a first area of a first polishing pad. The second clamping element includes a second upper clamper and a second lower clamper for clamping a second area of the first polishing pad, the first area and the second area are opposite to each other. When the first polishing pad will be disconnected from the bottom surface of the polishing head and replaced by a second polishing pad, the first clamping element and the second clamping element are released from the first polishing pad.
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