Stacked module systems and methods
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United States of America Patent
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Aug 11, 2009
Grant Date -
Feb 14, 2008
app pub date -
Oct 4, 2007
filing date -
Oct 26, 2001
priority date (Note) -
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Abstract
The present invention stacks chip scale-packaged integrated circuits (CSPs) into modules that conserve PWB or other board surface area. In a preferred embodiment in accordance with the invention, a form standard associated with one or more CSPs provides a physical form that allows many of the varying package sizes found in the broad family of CSP packages to be used to advantage while employing a standard connective flex circuitry design. In a preferred embodiment, the contacts of the lower CSP will be compressed before flex circuitry is attached to a combination of the CSP and a form standard to create lower profile contacts between CSP and the flex circuitry.
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