Methods for depositing, releasing and packaging micro-electromechanical devices on wafer substrates
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United States of America Patent
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Aug 11, 2009
Grant Date -
Jan 4, 2007
app pub date -
Apr 7, 2005
filing date -
Dec 7, 2000
priority date (Note) -
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Abstract
A method for forming a MEMS device is disclosed, where a final release step is performed just prior to a wafer bonding step to protect the MEMS device from contamination, physical contact, or other deleterious external events. Without additional changes to the MEMS structure between release and wafer bonding and singulation, except for an optional stiction treatment, the MEMS device is best protected and overall process flow is improved. The method is applicable to the production of any MEMS device and is particularly beneficial in the making of fragile micromirrors.
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