Semiconductor module in which a semiconductor package is bonded on a mount substrate
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United States of America Patent
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Aug 11, 2009
Grant Date -
Jan 6, 2005
app pub date -
Apr 29, 2004
filing date -
May 6, 2003
priority date (Note) -
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Abstract
A semiconductor module comprises: semiconductor packages each comprising a semiconductor element, a wiring substrate having a wiring member connected to the semiconductor element and external terminals connected to the wiring member, and a first organic film formed on a side of the semiconductor element opposed to a side toward the wiring substrate; and a mount substrate, on which the semiconductor element is mounted. First of the semiconductor packages and second of the semiconductor packages are stacked. Second organic films are provided between the wiring substrate of the first semiconductor package and the first organic film of the second semiconductor package and between the mount substrate and the semiconductor package.
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