Semiconductor device assemblies and packages including multiple semiconductor device components
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United States of America Patent
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Aug 11, 2009
Grant Date -
Oct 6, 2005
app pub date -
May 27, 2005
filing date -
Jun 27, 2002
priority date (Note) -
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Abstract
A multidie semiconductor device assembly or package includes an interposer comprising a substrate with at least one receptacle therethrough. A plurality of semiconductor device components (e.g., semiconductor devices) may be assembled with the interposer. For example, at least one contact pad of a semiconductor device component adjacent to one surface of the interposer may be electrically connected to a corresponding contact pad of another semiconductor device component positioned adjacent to an opposite surface of the interposer. As another example, multiple semiconductor device components may be at least partially superimposed relative to one another and at least partially disposed within a receptacle of the interposer.
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