Electropolishing system and process
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United States of America Patent
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Aug 25, 2009
Grant Date -
Jan 15, 2004
app pub date -
Mar 18, 2003
filing date -
Dec 1, 1998
priority date (Note) -
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Abstract
The present invention provides a process for electropolishing a conductive surface of a semiconductor wafer. During the process, a contact electrode in a contact solution contacts a contact region on surface of the conductive layer with the contact solution. Further, during the process a process electrode in a process solution contacts a process region on the conductive surface with the process solution while applying an electrical potential between the contact electrode and the process electrode to electropolish the surface of the conductive layer of the process region.
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