Microelectronic spring contact elements
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United States of America Patent
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Aug 25, 2009
Issued Date -
N/A
app pub date -
Apr 8, 2004
filing date -
Nov 16, 1993
priority date (Note) -
Expired
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Abstract
Spring contact elements are fabricated by depositing at least one layer of metallic material into openings defined in masking layers deposited on a surface of a substrate which may be an electronic component such as an active semiconductor device. Each spring contact element has a base end, a contact end, and a central body portion. The contact end is offset in the z-axis (at a different height) and in at least one of the x and y directions from the base end. In this manner, a plurality of spring contact elements are fabricated in a prescribed spatial relationship with one another on the substrate. The spring contact elements make temporary (i.e., pressure) or permanent (e.g., joined by soldering or brazing or with a conductive adhesive) connections with terminals of another electronic component to effect electrical connections therebetween. In an exemplary application, the spring contact elements are disposed on a semiconductor devices resident on a semiconductor wafer so that temporary connections can be made with the semiconductor devices to burn-in and/or test the semiconductor devices.
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- 15 United States
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Patent Owner(s)
- FORMFACTOR, INC.
International Classification(s)
Inventor(s)
Inventor Name | Address | # of filed Patents | Total Citations |
---|---|---|---|
Eldridge, Benjamin N | Danville , US | 256 | 13754 |
Khandros, Igor Y | Orinda , US | 226 | 18932 |
Mathieu, Gaetan L | Livermore , US | 190 | 12779 |
Pedersen, David V | Scotts Valley , US | 60 | 3603 |
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Fee | Large entity fee | small entity fee | micro entity fee |
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Surcharge after expiration - Late payment is unavoidable | $700.00 | $350.00 | $175.00 |
Surcharge after expiration - Late payment is unintentional | $1,640.00 | $820.00 | $410.00 |
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