Method and compositions for direct copper plating and filing to form interconnects in the fabrication of semiconductor devices

United States of America Patent

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Aug 25, 2009
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Nov 29, 2007
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Feb 20, 2007
filing date
Feb 21, 2006

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Abstract

The object of the present invention is a method and compositions for direct copper plating and filling to form interconnects in the fabrication of semiconductor devices.

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ALCHIMER

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H01L:SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICE....

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Inventor Name	Address	# of filed Patents	Total Citations
Gonzalez, José	Paris , FR	7	20
Monchoix, Hervé	Saint-ismier , FR	8	20

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Method and compositions for direct copper plating and filing to form interconnects in the fabrication of semiconductor devices

Number of patents in Portfolio can not be more than 2000

United States of America Patent

11708293

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PATENT NO	7579274
APP PUB NO	20070272560A1
SERIAL NO	11708293
DOCKET NO

US Family Size	Non-US Coverage
Patent Longevity	Forward Citations

DATE PUBLISHED	PUBLICATION/PATENT NO.	PUBLICATION TYPE
August 25, 2009	US,7579274,B2 US7579274B2	GRANTED PATENT AS SECOND PUBLICATION
November 29, 2007	US,20070272560,A1 US20070272560A1	FIRST PUBLISHED PATENT APPLICATION

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11708293

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