Methods and apparatus for improved thermal performance and electromagnetic interference (EMI) shielding in leadframe integrated circuit (IC) packages
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United States of America Patent
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Sep 1, 2009
Grant Date -
Apr 26, 2007
app pub date -
Oct 20, 2005
filing date -
Oct 20, 2005
priority date (Note) -
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Abstract
Methods and apparatus for improved thermal performance and electromagnetic interference (EMI) shielding in integrated circuit (IC) packages is described. A die-up or die-down package includes a heat spreader cap defining a cavity, an IC die, and a leadframe. The leadframe includes a centrally located die attach pad, a plurality of leads, and a plurality of tie bars that couple the die attach pad to the leads. The IC die is mounted to the die attach pad. A planar rim portion of the cap that surrounds the cavity is coupled to the leadframe. The cap and the leadframe form an enclosure structure that substantially encloses the IC die, and shields EMI emanating from and radiating towards the IC die. The enclosure structure also dissipates heat generated by the IC die during operation.
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