Flip chip in leaded molded package and method of manufacture thereof
Number of patents in Portfolio can not be more than 2000
United States of America Patent
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Sep 1, 2009
Grant Date -
Feb 14, 2008
app pub date -
Mar 29, 2007
filing date -
Dec 16, 1999
priority date (Note) -
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status (Latency Note)
Importance
Abstract
A chip device that includes a leadframe, a die and a mold compound. The backside of the die is metallized and exposed through a window defined within a mold compound that encapsulates the die when it is coupled to the leadframe. Leads on the leadframe are coupled to source and gate terminals on the die while the metallized backside of the die serves as the drain terminals.
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