Multiple chip package module including die stacked over encapsulated package
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United States of America Patent
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Sep 1, 2009
Grant Date -
Nov 9, 2006
app pub date -
May 5, 2006
filing date -
May 5, 2005
priority date (Note) -
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status (Latency Note)
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Abstract
A module having multiple die includes a first package (such as a land grid array package) inverted and mounted upon a lower substrate, and one or more die mounted or stacked over the upward-facing side of the inverted package.
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