Probing structure with fine pitch probes
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United States of America Patent
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Sep 1, 2009
Grant Date -
Jul 24, 2008
app pub date -
Jan 18, 2007
filing date -
Jan 18, 2007
priority date (Note) -
Expired
status (Latency Note)
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Abstract
A microelectronic resilient structure can comprise a support member and a platform attached to the support member. The platform can comprise a non-conductive, resilient beam that extends away from the support member, and a plurality of conductive members can be disposed on the beams. The conductive members can extend along a length of the beam. A plurality of conductive contact elements can be disposed on the beam and electrically connected to one of the conductive members.
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