Packaged microelectronic imagers and methods of packaging microelectronic imagers
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United States of America Patent
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Sep 1, 2009
Grant Date -
May 26, 2005
app pub date -
Nov 26, 2003
filing date -
Nov 26, 2003
priority date (Note) -
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Abstract
A microelectronic imager having an imaging unit and an optics unit attached to the imaging unit, and methods for packaging microelectronic imagers. In one embodiment, the imaging unit can include a microelectronic die with an image sensor and a plurality of external contacts electrically coupled to the image sensor and a first referencing element fixed to the imaging unit. The optics unit can include an optic member and a second referencing element fixed to the optics unit. The second referencing element is seated with the first referencing element at a fixed, preset position in which the optic member is situated at a desired location relative to the image sensor.
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