Method for making a microcircuit card
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United States of America Patent
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Sep 8, 2009
Grant Date -
Oct 13, 2005
app pub date -
Dec 18, 2002
filing date -
Dec 19, 2001
priority date (Note) -
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status (Latency Note)
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Abstract
A method for mounting a microcircuit module in a card body to make the card non-detachable without damage includes fixing the module (22) in a cavity (12) of the card body (11) with a resin after adjusting the adherence of the resin (30) on the wall of the cavity (12) so that it is markedly higher than its adherence on the module (22).
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