Wafer edge surface treatment with liquid meniscus
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United States of America Patent
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Sep 8, 2009
Grant Date -
N/A
app pub date -
Dec 2, 2005
filing date -
Jun 30, 2000
priority date (Note) -
In Force
status (Latency Note)
Importance
Abstract
A method for cleaning an edge surface of a semiconductor substrate is disclosed. The proximity head unit is positioned so that the flow head portion and the collection head portion of the proximity head unit are proximate to the edge surface of the semiconductor substrate. The semiconductor substrate is then rotated using one or more powered rollers. During the rotation of the semiconductor substrate, the flow head portion applies a fluid to the edge surface while the collection head portion collects fluid from the edge surface. Additional methods, an apparatuses, and a system for cleaning an edge surface of a semiconductor substrate are also described.
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