Inkjet printhead with integrated circuit mounted on polymer sealing film
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United States of America Patent
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Sep 8, 2009
Grant Date -
Jul 21, 2005
app pub date -
Dec 20, 2004
filing date -
Jan 21, 2004
priority date (Note) -
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status (Latency Note)
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Abstract
A printhead for an inkjet printer, the printhead comprising: a printhead integrated circuit formed on a wafer substrate using lithographically masked etching and deposition techniques; an integrated circuit support structure for mounting in the printer adjacent a media feed path; and, a polymer sealing film between the integrated circuit support structure and the printhead integrated circuit for fixing the printhead integrated circuit to the integrated circuit support structure.
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Cited Art Landscape
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