Performance enhancing contact module assemblies

Number of patents in Portfolio can not be more than 2000

United States of America Patent

PATENT NO 7585186
APP PUB NO 20090093158A1
SERIAL NO

11869417

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ATTORNEY / AGENT: (SPONSORED)

Importance

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Abstract

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A contact module assembly includes a dielectric body having a mating end with a plurality of mating contacts and a mounting end with a plurality of mounting contacts. A lead frame is at least partially encased by the dielectric body, wherein the lead frame has a plurality of conductors representing both signal conductors and ground conductors extending alone a lead frame plane. The signal and ground conductors extend from respective ones of the mating contacts and the mounting contacts, wherein at least some of the ground conductors include a mating contact terminal proximate the respective mating contact and a mounting contact terminal proximate the respective mounting contact. The ground conductors extend only partially between the mating contact and the mounting contact associated with the respective ground conductor such that a gap exists between the mating contact terminal and the mounting contact terminal of the ground conductor. A commoning member electrically connects the mating contact terminal and the mounting contact terminal of at least one of the ground conductors, wherein the commoning member is oriented in a non-coplanar relation with the lead frame plane.

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First Claim

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Patent Owner(s)

  • TE CONNECTIVITY CORPORATION

International Classification(s)

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Fedder, James Lee Etters , US 41 1331
Glover, Doug W Dauphin , US 1 60
McAlonis, Matthew Richard Elizabethtown , US 41 685
Rothermel, Brent Ryan Pottstown , US 15 1158
Sipe, Lynn Robert Mifflintown , US 31 1333

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