Multiple-dice packages using elements between dice to control application of underfill material to reduce void formation
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United States of America Patent
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Sep 15, 2009
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app pub date -
Jun 30, 2006
filing date -
Jun 30, 2006
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Abstract
Application of underfill material may be controlled to minimize the formation of voids between a plurality of integrated circuit (“IC”) dice and a substrate in an IC package. One or more elements are located in a gap between two dice to control the flow of underfill material and minimize the formation of voids within the underfill material. In an embodiment, an element may be an active electrical component, a passive electrical component, or a non-functional electrical component. Methods of fabrication, as well as application of the package to an electronic assembly and to an electronic system, are also described.
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