Semiconductor chip and semiconductor device using the same, and method of fabricating semiconductor chip
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United States of America Patent
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Sep 15, 2009
Grant Date -
Aug 15, 2002
app pub date -
Apr 11, 2002
filing date -
Feb 23, 1999
priority date (Note) -
In Force
status (Latency Note)
Importance
Abstract
A semiconductor chip in which a through hole penetrating through its surface and reverse surface is formed in a scribe line region in the vicinity of an active region where a functional device is formed, and a conductive member is arranged in the through portion. The through portion may be a groove opening sideward on a sidewall surface of the semiconductor chip. The through portion may be a through hole blocked from a side part of the semiconductor chip. The semiconductor chip may further include wiring for electrically connecting an internal circuit formed in the active region and the conductive member to each other.
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