US Patent No: 7,592,817

Number of patents in Portfolio can not be more than 2000

Alignment correction system and method of use

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ALSO PUBLISHED AS: 20090021236
ATTORNEY / AGENT: (SPONSORED)
 

Importance

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Abstract

A system and method for correcting alignment of a product on a tool and, more particularly, to a system and method for correcting alignment of a wafer on a chuck of a tool. The system is a tool comprising at least one contact near a circumference of the tool and a grounded contact proximate to the at least one contact. The method comprises measuring current on each branch of a circuit and calculating an angle of a wafer based on a difference in the current on each branch of the circuit.

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First Claim

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Patent Owner(s)

Patent OwnerAddressTotal Patents
INTERNATIONAL BUSINESS MACHINES CORPORATIONARMONK, NY68180

International Classification(s)

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  • [Patents Count]

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Bottini, Clemente Marlboro, NY 14 2
Foster, Robert J Cornwall, GB 9 20
Young, Roger M Warwick, NY 24 9
Zangooie, Shahin - 24 10
Zhou, Lin Fishkill, NY 80 210

Cited Art

Patent Info (Count) # Cites Year
 
MICRON TECHNOLOGY, INC. (2)
5,759,007 Notch finder and combination wafer transfer machine 5 1996
6,456,378 Semiconductor wafer alignment methods and semiconductor wafer alignment tools 3 2001
 
ADE CORPORATION (1)
4,457,664 Wafer alignment station 75 1982
 
H-SQUARE CORPORATION (1)
5,551,829 Notch finder having a flexible alignment rod 9 1995
 
HYNIX SEMICONDUCTOR INC. (1)
7,123,362 Method for aligning wafer 1 2004
 
NATIONAL SEMICONDUCTOR CORPORATION (1)
7,388,385 Wafer dicing system 1 2005
 
RUDOLPH TECHNOLOGIES, INC. (1)
6,324,298 Automated wafer defect inspection system and a process of performing such inspection 118 1999
 
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. (1)
7,494,830 Method and device for wafer backside alignment overlay accuracy 2 2007

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