Technique for forming a thermally conductive interface with patterned metal foil
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United States of America Patent
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Sep 22, 2009
Grant Date -
Apr 26, 2007
app pub date -
Oct 25, 2006
filing date -
Oct 26, 2005
priority date (Note) -
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Abstract
A technique for forming a thermally conductive interface with patterned metal foil is disclosed. In one particular exemplary embodiment, the technique may be realized as a thermally conductive metal foil having at least one patterned surface for facilitating heat dissipation from at least one integrated circuit device to at least one heat sink. The metal foil preferably has a characteristic formability and softness that may be exemplified by alloys of lead, indium, tin, and other malleable metals, and/or composites comprising layers of at least one malleable metal alloy.
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