Surface mount package
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United States of America Patent
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-
Sep 29, 2009
Grant Date -
Nov 30, 2006
app pub date -
May 24, 2005
filing date -
May 24, 2005
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
A surface mount package is provided that includes a first metal layer and a second metal layer configured to be electrically connected to the first metal layer. The surface mount package further includes a ceramic layer between the first and second metal layers. The ceramic layer has an opening therethrough.
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Cited Art Landscape
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