Method of making light emitting device having a molded encapsulant
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United States of America Patent
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Sep 29, 2009
Grant Date -
Jun 21, 2007
app pub date -
Oct 20, 2006
filing date -
Oct 24, 2005
priority date (Note) -
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Abstract
Disclosed herein is a method of making a light emitting device comprising an LED and a molded silicon-containing encapsulant. The method includes contacting the LED with a photopolymerizable composition containing a silicon-containing resin having silicon-bonded hydrogen and aliphatic unsaturation and two metal-containing catalysts. One catalyst may be activated by actinic radiation, and the second by heat but not the actinic radiation. Polymerization of the photopolymerizable composition to form the encapsulant may be carried out by selectively activating the different catalysts. At some point before polymerization is complete, a mold is used to impart a predetermined shape to the encapsulant.
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