Flex-based circuit module
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United States of America Patent
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Sep 29, 2009
Grant Date -
Dec 1, 2005
app pub date -
Jul 1, 2005
filing date -
Oct 26, 2001
priority date (Note) -
In Force
status (Latency Note)
Importance
Abstract
A form standard provides a physical form that allows many of the varying package sizes found in the broad family of CSP packages to be used to advantage while employing a standard connective flex circuitry design that is disposed about the form. In a preferred embodiment, the form standard will be devised of heat transference material such as copper to improve thermal performance.
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