Wire bonding capillary tool having multiple outer steps
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
Oct 6, 2009
Issued Date -
N/A
app pub date -
Apr 10, 2006
filing date -
Apr 10, 2006
priority date (Note) -
In Force
status (Latency Note)
Importance
Abstract
A bonding tool for bonding a fine wire to a substrate, said bonding tool comprising an at least substantially cylindrical portion having a concentric capillary therein through which the fine wire runs; a working tip portion formed at an end of the cylindrical portion being tapered towards the tip thereof, said working tip portion having an annular chamfer at the tip thereof; wherein the concentric capillary opens into the annular chamfer of the working tip, and wherein the diameter of the cylindrical portion decreases consecutively at a plurality of discrete intervals along the length of the cylindrical portion towards the working tip portion.
First Claim
Family
International Classification(s)
Cited Art Landscape
Patent Citation Ranking
Advertisement
Advertisement
Advertisement
Recipient Email Address
Recipient Email Address
Comment
Recipient Email Address
Add to Portfolio(s)
To add this patent to one, or more, of your portfolios, simply click the add button.
This Patent is in these Portfolios:
Add to additional portfolios:
Last Refreshed On:
Changes done successfully