Post etch wafer surface cleaning with liquid meniscus
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United States of America Patent
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Oct 6, 2009
Grant Date -
Oct 18, 2007
app pub date -
Jun 28, 2006
filing date -
Sep 30, 2002
priority date (Note) -
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Abstract
A method for cleaning the surface of a semiconductor wafer is disclosed. A first cleaning solution is applied to the wafer surface to remove contaminants on the wafer surface. The first cleaning solution is removed with some of the contaminants on the wafer surface. Next, an oxidizer solution is applied to the wafer surface. The oxidizer solution forms an oxidized layer on remaining contaminants. The oxidizer solution is removed and then a second cleaning solution is applied to the wafer surface. The second cleaning solution is removed from the wafer surface. The cleaning solution is configured to substantially remove the oxidized layer along with the remaining contaminants.
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