Methods and apparatuses for electrochemical deposition
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United States of America Patent
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Oct 6, 2009
Grant Date -
Sep 7, 2006
app pub date -
Mar 4, 2005
filing date -
Mar 4, 2005
priority date (Note) -
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Abstract
Methods and apparatuses for electrochemically depositing a metal layer onto a substrate. An electrochemical deposition apparatus comprises a substrate holder assembly including a substrate chuck and a relatively soft cathode contact ring. The cathode contact ring comprises an inner portion and an outer portion, wherein the inner portion directly contacts the substrate. An anode is disposed in an electrolyte container. A power supply connects the substrate holder assembly and the anode.
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