Material composition for packaging of light-sensitive components and method of using the same
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
Oct 6, 2009
Grant Date -
Nov 4, 2004
app pub date -
Feb 27, 2004
filing date -
Feb 27, 2003
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
The invention pertains to a material composition for packaging. The composition comprises (a) an epoxy resin and (b) a curing agent, wherein the mixing ratio of said epoxy resin to said curing agent is in the range of from 0.7 to 1.1. The invention also pertains to a method of using said material composition for packaging a light-sensitive component on a substrate.
First Claim
Family
International Classification(s)
Cited Art Landscape
Patent Citation Ranking
Advertisement
Advertisement
Advertisement
Recipient Email Address
Recipient Email Address
Comment
Recipient Email Address
Add to Portfolio(s)
To add this patent to one, or more, of your portfolios, simply click the add button.
This Patent is in these Portfolios:
Add to additional portfolios:
Last Refreshed On:
Changes done successfully