Post-seed deposition process
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
Oct 6, 2009
Grant Date -
Aug 21, 2008
app pub date -
Feb 15, 2007
filing date -
Feb 15, 2007
priority date (Note) -
In Force
status (Latency Note)
Importance
Abstract
A method involves pattern etching a photoresist that is located on a wafer that contains a deposited seed layer to expose portions of the seed layer, plating the wafer so that plating metal builds up on only the exposed seed layer until the plating metal has reached an elevation above the seed layer that is at least equal to a thickness of the seed layer, removing the solid photoresist, and removing seed layer exposed by removal of the photoresist and plated metal until all of the exposed seed layer has been removed.
First Claim
Family
International Classification(s)
Cited Art Landscape
Patent Citation Ranking
Advertisement
Advertisement
Advertisement
Recipient Email Address
Recipient Email Address
Comment
Recipient Email Address
Add to Portfolio(s)
To add this patent to one, or more, of your portfolios, simply click the add button.
This Patent is in these Portfolios:
Add to additional portfolios:
Last Refreshed On:
Changes done successfully