Offset etched corner leads for semiconductor package
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United States of America Patent
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Oct 6, 2009
Grant Date -
N/A
app pub date -
Aug 3, 2004
filing date -
Feb 5, 2003
priority date (Note) -
In Force
status (Latency Note)
Importance
Abstract
A semiconductor package comprising a leadframe. The leadframe itself comprises an outer frame portion which defines a central opening. Disposed within the central opening is a die pad which defines opposed, generally planar top and bottom die pad surfaces and a peripheral edge. Connected to and extending between the outer frame portion and the peripheral edge of the die pad is at least one tie bar of the leadframe. The leadframe also includes a plurality of leads which are connected to the outer frame portion and extend into the opening at least partially about the die pad in spaced relation to the peripheral edge thereof. Each of the leads includes opposed, generally planar top and bottom lead surfaces, with at least two of the leads comprising corner leads which extend along opposed sides of the tie bar. Each of the corner leads further defines an angularly offset distal portion which extends along and in spaced relation to the tie bar.
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