Structure of polymer-matrix conductive film and method for fabricating the same

Number of patents in Portfolio can not be more than 2000

United States of America Patent

PATENT NO 7598609
APP PUB NO 20060081989A1
SERIAL NO

10998741

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Abstract

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A composite conductive film formed of a polymer-matrix and a plurality of conductive lines less than micro-sized and its fabricating method are provided. The conductive lines are arranged parallel and spaced apart from each other so as to provide anisotropic conductivity. The present conductive film can serve as an electrical connection between a fine-pitch chip and a substrate. Additionally, an adhesive layer is formed on two opposite sides of the conductive film along its conductive direction to increase adhesive areas. The strength and reliability of the package using the conductive film are thus enhanced.

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Patent Owner(s)

Patent OwnerAddress
INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTEHSINCHU

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Chen, Yu Chih Yilan County , TW 7 6
Cheng, Syh Yuh Hsinchu County , TW 5 5
Lin, Ren Jay Taipei County , TW 1 1
Uang, Ruoh Huey Hsinchu County , TW 5 16

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