High temperature ceramic die package and DUT board socket
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United States of America Patent
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Oct 6, 2009
Grant Date -
N/A
app pub date -
May 21, 2008
filing date -
May 21, 2008
priority date (Note) -
In Force
status (Latency Note)
Importance
Abstract
A strip-shaped package is provided that can accept a single die up to many dice. Conduction paths are printed (or otherwise integrally formed) thereon to the edge of the package, and a complementary socket may be provided that, in combination with the strip-shaped package, provides for electrical connection to test electronics without the use of package leads. The strip-shaped package may be made of ceramic or other temperature resistant material. The strip-shaped package may have at least one “well” location in which the die or dice may be affixed to the strip-shaped package. The strip may have notches configured to function as separators between the individual die housings (and related integrally-formed conduction paths).
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