Methods and apparatus of stacking DRAMs
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United States of America Patent
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Oct 6, 2009
Grant Date -
Jul 17, 2008
app pub date -
Mar 25, 2008
filing date -
Sep 2, 2005
priority date (Note) -
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Abstract
Large capacity memory systems are constructed using stacked memory integrated circuits or chips. The stacked memory chips are constructed in such a way that eliminates problems such as signal integrity while still meeting current and future memory standards.
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