Microelectronic contact structure and method of making same
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United States of America Patent
Stats
-
Oct 13, 2009
Issued Date -
N/A
app pub date -
Jul 11, 2006
filing date -
Nov 16, 1993
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
An electronic interconnection apparatus can include a sacrificial substrate, which can include first trenches and second trenches formed in the sacrificial substrate. The first trenches can be disposed below a surface of the sacrificial substrate, and the second trenches can be disposed below the first trenches. First sidewalls can connect the surface and the first trenches, and the first sidewalls can be angled with respect to the surface and the first trenches. Second sidewalls can connect the first trenches and the second trenches, and the second sidewalls can be angled with respect to the first trenches and the second trenches. Spring contact elements can reside upon the sacrificial substrate. Each of the spring contact elements can have a first portion disposed on the surface, a second portion disposed on one of the first trenches, and a third portion disposed on one of the second trenches.
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