Method of grinding back surface of semiconductor wafer and semiconductor wafer grinding apparatus
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United States of America Patent
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Oct 13, 2009
Grant Date -
May 10, 2007
app pub date -
Oct 30, 2006
filing date -
Oct 31, 2005
priority date (Note) -
Expired
status (Latency Note)
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Abstract
A semiconductor wafer back-surface grinding method, for grinding a back surface of a semiconductor wafer, an opposed front surface of the semiconductor wafer being adhered to a support base material and being provided with a circuit pattern, including: measuring an initial thickness of the semiconductor wafer before grinding, in a condition where the support base material is adhered to the front surface of the semiconductor wafer; obtaining a cutting depth by subtracting a set final thickness measured after grinding from the initial thickness; and grinding the back surface of the semiconductor wafer, based on the cutting depth.
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