Room temperature-curable, heat-conductive silicone rubber composition
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United States of America Patent
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Oct 13, 2009
Grant Date -
Apr 24, 2008
app pub date -
Oct 17, 2007
filing date -
Oct 18, 2006
priority date (Note) -
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Abstract
Provided is a room temperature-curable, heat-conductive silicone rubber composition, including: (A) a diorganopolysiloxane with both molecular chain terminals blocked with hydroxyl groups and/or organooxy groups, (B) a heat-conductive filler other than a palladium powder, (C) an organosilane containing two or more hydrolyzable groups, and/or a partial hydrolysis-condensation product thereof, and (D) a palladium powder. The composition improves on the drawbacks of the conventional technology, is able to suppress the quantity of hydrogen gas produced from the heat-conductive filler, exhibits superior storage properties, and yields a low-hardness cured product upon curing. The cured product is useful as a heat-conductive material for a heat-generating electronic component.
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