Surface mount composite electronic component and method for manufacturing same
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
Oct 13, 2009
Grant Date -
May 3, 2007
app pub date -
Nov 12, 2004
filing date -
Nov 18, 2003
priority date (Note) -
In Force
status (Latency Note)
Importance
Abstract
The present invention provides a surface mount composite electronic component which can be made compact. The structure of the surface mount composite electronic component is one in which a circuit element is formed on each of a set of opposing surfaces of an insulating substrate composed of a hexahedron, with electrodes that make up the circuit elements also functioning as external terminals. For example, a pair of first electrodes disposed on both ends of a front surface of the insulating substrate composed of a hexahedron, a pair of second electrodes disposed on a rear surface of the insulating substrate opposite the first electrodes, a first resistor disposed so as to contact both of the first pair of electrodes, and a second resistor disposed so as to contact both of the second electrodes.
First Claim
Family
International Classification(s)
Cited Art Landscape
Patent Citation Ranking
Advertisement
Advertisement
Advertisement
Recipient Email Address
Recipient Email Address
Comment
Recipient Email Address
Add to Portfolio(s)
To add this patent to one, or more, of your portfolios, simply click the add button.
This Patent is in these Portfolios:
Add to additional portfolios:
Last Refreshed On:
Changes done successfully