Semiconductor device with stacked chips and method for manufacturing thereof
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
Oct 20, 2009
Grant Date -
Feb 7, 2008
app pub date -
Jul 7, 2006
filing date -
Jul 7, 2006
priority date (Note) -
In Force
status (Latency Note)
Importance
Abstract
A semiconductor device includes a first semiconductor device and a second semiconductor device. Through-holes in the second semiconductor device extend from an upper side of the second semiconductor device adjacent contact pads to a bottom side of the second device. Tower contact bumps are electrically connected to contact pads of the first semiconductor device. The second semiconductor device is arranged adjacent the first semiconductor device so that the tower contact bumps are disposed within the through-holes and are electrically connected with contact pads of the second semiconductor device.
First Claim
Family
International Classification(s)
Cited Art Landscape
Patent Citation Ranking
Advertisement
Advertisement
Advertisement
Recipient Email Address
Recipient Email Address
Comment
Recipient Email Address
Add to Portfolio(s)
To add this patent to one, or more, of your portfolios, simply click the add button.
This Patent is in these Portfolios:
Add to additional portfolios:
Last Refreshed On:
Changes done successfully