RF power transistor having an encapsulated chip package
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United States of America Patent
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Oct 20, 2009
Grant Date -
Dec 27, 2007
app pub date -
Jun 27, 2006
filing date -
Jun 27, 2006
priority date (Note) -
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Abstract
In various embodiments, semiconductor components and methods to manufacture semiconductor components are disclosed. In one embodiment, a method to manufacture semiconductor components includes attaching multiple heat spreaders to a semiconductor wafer. Other embodiments are described and claimed.
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