Semiconductor die attachment for high vacuum tubes
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United States of America Patent
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Oct 27, 2009
Issued Date -
N/A
app pub date -
Jul 28, 2005
filing date -
May 14, 2004
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Abstract
Bonding and interconnect techniques including a spacer for use with semiconductor die for the creation of thermally efficient, physically compliant Ultra High Vacuum Tubes and the tube resulting therefrom.
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