Processing thin wafers

United States of America Patent

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Nov 3, 2009
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May 18, 2006
app pub date
Aug 31, 2005
filing date
Nov 18, 2004

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Abstract

There is described a wafer processing system for thinned wafers that are easily broken during handling. The system protects against breakage during handling and provides for temperature controls during processing.

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INTEVAC INC	3560 BASSETT STREET SANTA CLARA CA 95054

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Inventor Name	Address	# of filed Patents	Total Citations
Bluck, Terry	Santa Clara County , US	86	2628
Scollay, Stuart	Santa Clara County , US	11	60
Tong, Edric	Santa Clara County , US	31	716

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Processing thin wafers

Number of patents in Portfolio can not be more than 2000

United States of America Patent

11218085

048635-002100

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PATENT NO	7611322
APP PUB NO	20060102285A1
SERIAL NO	11218085
DOCKET NO	048635-002100

US Family Size	Non-US Coverage
Patent Longevity	Forward Citations

DATE PUBLISHED	PUBLICATION/PATENT NO.	PUBLICATION TYPE
November 03, 2009	US,7611322,B2 US7611322B2	GRANTED PATENT AS SECOND PUBLICATION
May 18, 2006	US,20060102285,A1 US20060102285A1	FIRST PUBLISHED PATENT APPLICATION

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11218085

048635-002100

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