Semiconductor polishing composition
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United States of America Patent
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Nov 3, 2009
Grant Date -
Nov 22, 2007
app pub date -
Mar 28, 2005
filing date -
Mar 29, 2004
priority date (Note) -
Expired
status (Latency Note)
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Abstract
A semiconductor polishing composition is disclosed. The composition includes fumed silica. The semiconductor polishing composition is an aqueous dispersion solution of fumed silica. Further, the number of particles of fumed silica having a particle diameter of 0.5 μm or more is 600,000 pieces/ml or less and the number of particles of fumed silica having a particle diameter of 1 μm or more is 6000 pieces/ml or less.
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