Electronic device and method of manufacturing the same, chip carrier, circuit board, and electronic instrument
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United States of America Patent
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Nov 3, 2009
Grant Date -
Jun 12, 2008
app pub date -
Nov 30, 2007
filing date -
Mar 13, 2003
priority date (Note) -
In Force
status (Latency Note)
Importance
Abstract
An external terminal is formed on an interconnect pattern formed on a substrate by using a soldering material. Subsequently, a chip component having an electrode is mounted on the substrate. An interconnect for electrically connecting the electrode and the interconnect pattern is formed at a temperature lower than a melting point of the soldering material.
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