Visually inspectable surface mount device pad
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United States of America Patent
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Nov 3, 2009
Grant Date -
Mar 2, 2006
app pub date -
Aug 31, 2005
filing date -
Aug 31, 2004
priority date (Note) -
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Abstract
A printed circuit board having one or more vias disposed in the surface area of a pad. The pad may serve as a connection point between the printed circuit board and another circuit board and is disposed along the edge of the board such that the vias do not form half vias.
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