Controls of ambient environment during wafer drying using proximity head
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United States of America Patent
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Nov 10, 2009
Grant Date -
Jul 7, 2005
app pub date -
Apr 1, 2004
filing date -
Sep 30, 2002
priority date (Note) -
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Abstract
A method for processing a substrate is provided which includes generating a fluid meniscus to process the substrate and applying the fluid meniscus to a surface of the substrate. The method further includes reducing evaporation of fluids from a surface in the substrate processing environment.
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